• Multifunctional tin planting pad supports CPU, and chips, suitable for chips with hard drives and soldering thickness up to 0.9mm
• Highly flexible and non-deforming, good elasticity, can be freely curled, maintains shape and performance over long-term use
• Heat-resistant and non-slip, can withstand high temperatures up to 500 Celcius, has adhesive properties, providing anti-slip effects
• High-strength magnetic steel screen, strong magnetic adsorption design, ensuring more secure and stable soldering, won't fall off even when shaken vigorously
• Good compatibility, compatible with chips thinner than 0.9mm most current smartphone chips assist with soldering

LUOWEI HEAT INSULATION GREEN TIN PAD Multifunctional tin planting pad supports CPU, and chips, suitable for chips with hard drives, Highly flexible and non-deforming, good elasticity, can be freely curled, maintains shape, performance over long-term use, Heat-resistant and non-slip, has adhesive properties, providing anti-slip effects, High-strength magnetic steel screen, strong magnetic adsorption design, ensuring more secure and stable soldering, won't fall off even when shaken vigorously, Good compatibility, compatible with chips thinner than 0.9mm most current smartphone chips assist with soldering

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